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For transverse crack : Magnetic particle inspection as it will be at 90 degree to the path of magnetic lines. (This can be overcome if magnetic field is again applied 90 dgree) For Longitudinal cracks: DP, Eddy current, etc. But your question is very subjective. You should ask very specific
For transverse crack : Magnetic particle inspection as it will be at 90 degree to the path of magnetic lines.
(This can be overcome if magnetic field is again applied 90 dgree)
For Longitudinal cracks: DP, Eddy current, etc.
But your question is very subjective. You should ask very specific
For internal crack, we have to prefer Ultrasonic testing. In UT we can Use normal beam probe for longitudinal defects and Angle beam probe (45, 60, 70 deg) for both longitudinal and transverse defects without destruct the job.
For internal crack, we have to prefer Ultrasonic testing. In UT we can Use normal beam probe for longitudinal defects and Angle beam probe (45, 60, 70 deg) for both longitudinal and transverse defects without destruct the job.
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For transverse crack : Magnetic particle inspection as it will be at 90 degree to the path of magnetic lines. (This can be overcome if magnetic field is again applied 90 dgree) For Longitudinal cracks: DP, Eddy current, etc. But your question is very subjective. You should ask very specific
For transverse crack : Magnetic particle inspection as it will be at 90 degree to the path of magnetic lines.
(This can be overcome if magnetic field is again applied 90 dgree)
For Longitudinal cracks: DP, Eddy current, etc.
But your question is very subjective. You should ask very specific
See lessFor internal crack, we have to prefer Ultrasonic testing. In UT we can Use normal beam probe for longitudinal defects and Angle beam probe (45, 60, 70 deg) for both longitudinal and transverse defects without destruct the job.
For internal crack, we have to prefer Ultrasonic testing. In UT we can Use normal beam probe for longitudinal defects and Angle beam probe (45, 60, 70 deg) for both longitudinal and transverse defects without destruct the job.
See less